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CHEMIA-017
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The preparation is harmless, non-flammable water-based solution. It quickly removes any types of flux, solder pastes and SMT adhesives as well as other debris resulting from the process of soldering with templates and printed circuit boards. Ready-for-use product – DO NOT DILUTE.
Mix thoroughly before use.
Method of use: Pour the solution directly into the ultrasonic cleaner. Clean with ultrasound for at least 10 minutes. Remove the board and rinse under running water. ! It is recommended to rinse the board under tap water and then under demineralised or deionised water to remove any residues. Allow to dry at room temperature or dry it
with a stream of hot air.
Application: